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About this event Next-generation AI systems are pushing electrical, optical, and packaging technologies to their limits. Join Keysight experts as they share insights on validating 224G / 448G SerDes, preparing for emerging IEEE 1.6T optical standards, advancing silicon photonics, and strengthening die-to-die interconnects for chiplet-based architectures. This is your chance to learn directly from the engineers shaping the …
All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE
Hyatt Regency Hotel, Santa Clara, CA
Santa Clara, CA, United States
DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog, Verilog, VHDL, PSS, SystemC and e, as well as general purpose languages such as …
The premier conference for innovators incorporating computer vision and AI in products The 2025 Summit has now concluded. Join us May 11-13, 2026! Attend an Immersive Experience At the premier conference for innovators incorporating computer vision and AI into products Join 1,400+ product and application developers, business leaders, investors and customers—all focused on perceptual AI …
What is the AI Infra Summit? The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to …
