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Webinar: Reducing Semiconductor Packaging Defects with Ansys Tools

Online

Ansys Semiconductor Manufacturing Webinar Series: Part 2 of 3. Join us on Thursday, May 23rd for an in-depth discussion on reducing defects in the semiconductor packaging process. Learn more about the webinar series! TIME: THURSDAY, MAY 23, 2024 11 AM EASTERN TIME Venue: Virtual Overview Semiconductor packaging involves integrating heterogeneous chips with different functionalities into a …

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Webinar: Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation

Online

Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and manufacture. Date: Thursday, September 5, 2024 Time: 15:00 BST, 16:00 CEST, 10:00 EDT Venue: Online Questions Should you have any questions please contact uk-marketing@ansys.com About this …

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