Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as …
EMPC 2025 is the 25th European Microelectronics & Packaging Conference, an international event for microelectronics packaging, assembly, and interconnection technologies, taking place in Grenoble, France, from September 16–18, 2025. The conference …
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The Premier Event for the UK Microelectronics Industry Join thousands of your peers at the premier event uniting the entire value chains across the microelectronics, semiconductor, photonics and embedded systems …
September 29 - October 2, 2025 Co-located with Semiconductor thermal management Town & Country resort San Diego, California The 58th International Symposium on Microelectronics is organized by the International Microelectronics …
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, …
About IRPS For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants …
