Abstract 5G RedCap is an exciting new 3GPP feature, soon to be introduced in Rel. 17 of the standard, targeting reduced capability use cases for industrial, wearables, and IoT in general. We will discuss the new standard, the market potential, and CEVA’s new PentaG2-Lite comprehensive baseband modem solution. Join CEVA to learn about: Introduction to …
Tuesday, August 30 - TSMC Taiwan Technology Symposium Join us and learn about: TSMC's smartphone, HPC, IoT, and automotive platform solutions TSMC's advanced technology progress on 5nm, 4nm, 3nm processes and beyond TSMC's specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on …
FDL is a well-established international forum to exchange experiences and promote new trends in the application of languages, their associated design methods, and tools for the design of electronic systems. FDL stimulates scientific and controversial discussions within and in-between scientific topics as described below. The program structure includes research working sessions, embedded tutorials, panels, and technical discussions. …
Continue reading "FDL 2022: Forum on Specification & Design Languages"
For more than 30 years PCB West has trained designers, engineers, fabricators and, lately, assemblers on making printed circuit boards for every product or use imaginable. More than 2,500 designers, fabricators, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace …
31 JANUARY - 2 FEBRUARY 2023 BARCELONA - GRAN VIA VENUE HALL 4 LEADING DIGITAL TRANSFORMATION Your radar into industry transformation! Explore the potential of new products, services, and business models, and understand how these technologies will soon be foundational to your business. Learn from the brightest leaders from the world’s most prominent and disruptive brands – all looking to …
About Rambus Design Summit Back for its fourth year, the Rambus Design Summit is a virtual conference focused on the key technologies critical to enabling performance and security for data center, AI/ML, automotive and IoT applications. Agenda + Abstracts Rambus Design Summit will take place over two days, with day one focusing on memory & …
Presented by Mark Quartermain, Director IoT Technology Management & Matthias Hertel, Senior Manager - Embedded Tools Integration About this talk The ability to add greater levels of intelligence to endpoint devices opens up a huge variety of new use cases. However, achieving the required levels of DSP and ML compute performance in these devices - …
Continue reading "Webinar: Bringing Intelligence to Constrained Endpoint Devices"
Cyber security, data privacy, AI, boot storage, IoT, mission critical data and autonomous driving, ‘one size fits all’ is not the solution This webinar delves into the important process of designing/ selecting the optimal storage module to suit specific use cases. All too often, companies invest in the wrong solutions without consideration for the end …
For its third edition, Electronics Asia Conference (EAC) will put the spotlight on trends and technology innovations that are driving the latest developments and new applications in sectors including Internet of Things (IoT), Artifcial Intelligence (AI), Embedded Systems, Industrial Automation, Smart Manufacturing, Supply Chain, and Wireless industries. Track 1: Internet of Things (IoT), Artifcial Intelligence …
Why SEDEX The Semiconductor Exhibition will be held at COEX from October 25 to 27, 2023. It is among one of the most outstanding exhibitions that covers the full spectrum of the semiconductor industry supply chain. No other event in the world showcases a full range of semiconductor products including SoC, IP, Memory, sensor, equipment/components …
Continue reading "The 25th Semiconductor Exhibition (SEDEX 2023)"
Learn how innovative analog IP can help analog design engineers. Agile Analog is transforming the analog IP industry, with Composa, our configurable, multi-process technology that automatically generates analog IP. We offer a wide-variety of novel analog IP solutions for Data Conversion, Power Management, IC Monitoring, Security and Always-On IPs. Applications include High Performance Computing (HPC), …
Sign up for this webinar; you’ll learn how AWS IoT TwinMaker, with its robust features and seamless integration with Ansys Twin Builder, enables the creation of comprehensive L3 and L4 digital twin solutions. See how businesses can unlock substantial value, gain insights, optimize operations, and enhance decision-making processes. TIME: APRIL 2, 2024 11 AM EDT …
Continue reading "Webinar: Unlock Business Value with AWS and Ansys Digital Twin"
Hardware security is essential for high-performance computing (HPC), AI, and Edge IoT applications when designing SoCs in advanced process nodes. These designs include Gigabits of SRAM and require storing >16Kb of repair information to meet yield requirements. Designers are facing the challenges of creating secure, reliable, and cost-effective SoC designs in a timely manner. If …
