Learn how to apply process integration and design optimization principles to computational fluid dynamics problems. Time: June 17, 2021 10 AM EDT / 3 PM BST / 7:30 PM IST Venue: Online In this webinar we will show how the power of interactive visualization and artificial intelligence (AI) technologies enables engineers and designers to gain …
LIVE WEBINAR | 21 JULY 2021 | 01:00 PM EST Learn how Simcenter supports the development of electric motors and inverters in this webinar series - Addressing the engineering challenges of electrification. This session explores how to frontload your development by sizing a motor appropriately to balance performance against energy consumption and thermal management. It also includes …
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LIVE WEBINAR | 26 JULY 2021 | 01:00 PM EST Learn how Simcenter can help with battery design from cell to pack integration in this webinar series - Addressing the engineering challenges of electrification. This session focuses on initial system-level simulation and integration with BiW, pack thermal simulation, controller designer, and thermal run away. The presentation compares …
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Intelligent Cross-Platform Workflows for RF PCB Integration November 2, 2021 Overview RF IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between RF design and manufacturing layout design platforms. Overcoming cross-platform interoperability issues shortens turnaround times and eliminates potential design errors. This webinar will demonstrate the ways in which the Cadence® …
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Time: February 16, 2022 9 AM EST / 2 PM BST / 7:30 PM IST Venue: Online About this Webinar This webinar completes our series of two Ansys Electrification IBP webinars. We'll share our solutions for battery and management systems. You'll learn the integration of battery, inverter, and electric motor components to design electric powertrains. …
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Date: Tuesday, September 20, 2022 Time: 10:00am PDT / 1:00pm EDT The RF PA MMIC worked as designed until it was integrated into the module housing, and then the overall performance shifted out of spec. Design failure at the point of system integration is a common cause of delayed product deliveries and engineering cost overruns. …
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November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET (A recording will be sent after the live event to all registrants) The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1 As the semiconductor industry …
Solving Vehicle Electromagnetic and Connectivity Challenges Webinar Series: May - July 2023 This free to attend webinar series will discuss the latest simulation processes, technologies and best practices to enable you to design, analyze and optimize the electromagnetic and electronic performance of your next vehicle. Attend and learn how you can optimize antenna placement, significantly …
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CEA-List and Menta SAS will present together the MOSAICS-LP project, a scalable chiplet platform REGISTER HERE
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges however, especially in the context of IP …
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Overview Title: Unveiling the Secrets to Proper Version Control, Seamless Data Integration, and Effective Collaboration Date: Wednesday, August 23, 2023 Time: 10:00 AM Pacific Time Duration: 30 minutes (+15 minutes live Q/A) Join us on Wednesday, August 23rd, to learn how to master semiconductor design success as we unveil the secrets to proper version control, seamless data integration, and effective …
