03 Mar 2020 - 05 Mar 2020 Fountain Hills, AZ, USA Join Cadence in Booth 42 at the International Microelectronics Assembly and Packaging Society (IMAPS)’s 16th annual Device Packaging Conference. The show is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these …
The 56th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ((IMAPS and held in San Diego, California at the Town & Country Resort. This year's program will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on SiP/Design/Manufacturing …
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts …
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