Presenter: Boris Murmann Description Abstract: Inspired by the possibilities of open-source chip design, the IEEE Solid-State Circuits Society (SSCS) launched its new Platform for IC Design Outreach (PICO) in the …
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Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so they behave as a single device. The new Tessent Multi-die software delivers comprehensive automation for the highly complex DFT tasks associated with these 2.5D and 3D IC designs. Tessent Multi-die software automates the generation and insertion of IEEE 1838 …
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The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was …
Continue reading "2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli"
About CICC The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The …
May 21 - May 25, 2023 Monterey, California, USA About IEEE ISCAS 2023 The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits …
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OPEN TO EVERYONE Note, The Michigan EMC Fest is May 25, 2023 <here> This will be a great MiniSymposium, guaranteed to sell out If you are working in the EMC field, …
The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This time we would like to invite you to Kraków. …
About DAC The Design Automation Conference (DAC) is recognized as the premier event for the design and design automation of electronic chips to systems. DAC offers outstanding training, education, exhibits …
VLSI-SoC 2023 is the 31st in a series of international conferences sponsored by the International Federation for Information Processing Technical Committee 10 Working Group 5, IEEE CEDA, and IEEE CASS, …
