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1 event,
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Date: Jun 25, 2026 | 9:00 AM PST In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys 3DIC Compiler platform that spans early planning through signoff. The webinar … |
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