You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!
Increase both performance and capacity for chip, interposer, package, and PCB using Clarity 2022.1 Overview The Cadence® Clarity™ 3D Solver, utilized by scores of customers across the globe, continues to accelerate design …
Meeting date: May 31, 2022 Meeting time: 14:00 - 15:00 (Beijing time) Rigid-flex PCBs are used in many modern electronic devices (such as mobile phones, laptops, and wearables, etc.) due to their form factor, light weight, and cost-effectiveness. Due to the complexity of 3D designs, electromagnetic (EM) analysis of rigid-flex PCBs has been a challenging task …
Date: Tuesday, November 16, 2023 Time: 10:00am PDT High-fidelity simulations in the ever-widening realm of complete systems analysis requires incorporating vendor-supplied models for accuracy. However, vendors are reluctant to share their proprietary intellectual property. Cadence enables the ecosystem and supports model creators by allowing them to encrypt their geometries and protect their IP while sharing them with their …
Today's electronic products increasingly use Rigid-Flex PCBs to compress form factors, reduce weight, and increase cost-effectiveness. For many commercially available 3D numerical solver technologies (FEM and FDTD), the electromagnetic (EM) analysis of rigid-flex PCBs has always been challenging due to the complexity of the 3D designs. Much of this complexity comes from bending the board into …