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Description Join us on January 29th at 12 PM ET for an exclusive panel discussion featuring Principal Engineer Diane Amuso and Sr. Staff Engineer Nicholas Mann. This webinar will dive into the capabilities of Ansys Sherlock, the industry-leading physics-based design analysis software for electronics reliability. Learn how Sherlock empowers engineers to predict product reliability, pinpoint …
The Spectre Simulation Platform is a solution for accurate analog simulation. Multiple requirements for analog, RF, memory and mixed-signal IC design and verification teams Built-in solvers simplify and speed up circuit, block and system level simulation tasks. This seminar will introduce industry-leading Spectre Simulation We would like to introduce the new features of Spectre 24.1, …
Edinburgh Futures Institute, The University of Edinburgh
1 Lauriston Pl, Edinburgh
Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will …
San Francisco Museum of Modern Art
151 3rd Street, San Francisco, CA, United States
Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …
The design of transcatheter valve replacements is a challenging task as manufacturing, treatment preparation, and deployment of the implant influence its final shape, performance, and fatigue life. While the purely …
Don't miss our upcoming webinar, where we'll explore the importance of safety in automotive design. This session will focus on the customer's high demand for integrated safety flows in verification, …
Don't miss our upcoming webinar, where we'll explore the importance of safety in automotive design. This session will focus on the customer's high demand for integrated safety flows in verification, digital, and analog design. We'll showcase the exceptional value of the Midas Safety Platform for engineers designing automotive safety applications, and how it seamlessly integrates …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …
Anaheim Convention Center
800 W Katella Ave, Anaheim, CA, United States
Fresh New Name. Same Great Event. Introducing MD&M West Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, and WestPack — we are now merging 4 of these related industry sectors into a single unified show: MD&M West. WestPack, well-known as the leading …
Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM CET / 8:30 PM IST Overview This webinar will delve into how Comer Industries, with the support of Asotech, leverages Ansys simulations to ensure the …
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …
Historically, PCB power distribution networks (PDNs) have been designed based on rules of thumb, such as “put a 0.1uF decoupling cap down for every power pin on the device”. These can lead to more capacitors than necessary, taking up additional space in the layout and driving up cost of the final assembly. In addition, they …
