Ray tracing is at the heart of optical design, enabling engineers to analyze and optimize the performance of optical systems across diverse applications. This webinar will explore how Ansys Zemax …
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Event Highlights As a part of the Simulation World 2025 event series, this event offers expert-led sessions, real-world success stories, and valuable insights into the Ansys simulation strategy. Hear from leading …
Join the ESD Alliance for an informative evening of networking, presentations, and a panel! Time 5:30 pm - 8:30 pm PDT How Multi-Physics is Reshaping Chip Design and EDA Tools Increasing system complexity and shrinking semiconductor devices are changing the chip design landscape. Traditional single-domain analyses are no longer sufficient to ensure a successful product. …
The 30th IEEE European Test Symposium (ETS) is Europe's premier forum dedicated to presenting and discussing scientific results, emerging ideas, hot topics and new trends, as well as industrial case-studies and applications in the area of electronic-based circuits and systems testing, reliability, safety, security and validation. This year we will celebrate the anniversary 30th edition of ETS! …
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About ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. The technical program contains papers covering leading edge developments …
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Overview VIRTUAL EVENT Join us for this virtual event showcasing the advancements in Stray Light Analysis for high-precision optical systems. Stray light can degrade image quality, reduce system performance, and …
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Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
Simulation plays a critical role in reducing automotive design cycles, providing key insights into design changes and optimizations before a single physical prototype is built. As automotive time-to-market demands shorten …
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Wednesday, May 28 - 8:00 AM Pacific Managing traceability across multiple disconnected tools and data is a challenge that often leads to inefficiencies, missed coverage, and increased risk in safety-critical designs. In this webinar, discover how Questa Verification IQ Testplan Author seamlessly integrates with Application Lifecycle Management tools (such as Siemens Polarion and Jama Connect) …
Despite remarkable advances in cardiovascular medicine, significant challenges remain—predicting sudden cardiac death, decoding complex imaging of fibrotic substrates, tailoring catheter ablation, guiding transcatheter valve implantation, and planning intricate surgical repairs. …
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Payloads are crucial for space missions, especially in observation. This webinar covers selecting sensors for wildfire detection and the importance of modeling payloads in their mission environment. DATE/TIME: May 29, …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical …
