WELCOME TO OUR AUTOMOTIVE COMPUTING CONFERENCES (ACC) in 2024 We are excited to explore the transformation of classic vehicles into modern, software-defined vehicles and IoT devices. As the automotive industry …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …
Join us for this webinar to explore how Ansys SynMatrix, powered by AI-driven automation and HFSS integration, is transforming RF filter design by streamlining workflows, optimizing performance, and accelerating time-to-market. …
Continue reading "Webinar: Accelerating Complex RF Filter Design With AI-Powered Optimization"
This webinar will cover the motivations and benefits of using in-system deterministic test and how using this new technology can become a central part of any SLM strategy.
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis techniques. For the past years, Synopsys and Ansys have …
Continue reading "Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design"
About Event Join us at the Infineon GaN Roadshow stop in San Jose to experience the future of power! This one-day symposium will dive deep into Infineon's Gallium Nitride power …
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design …
Continue reading "TSMC EU OIP Ecosystem Forum (In-Person Event)"
This is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab. TIME: November 19, 2024 …
With the EE Cockpit in Allegro X System Capture, electrical engineers can run analyses during the schematic design phase without needing complicated analysis setups or specialized models to get meaningful …
Continue reading "Webinar: Accelerating System Design Creation with Integrated Analysis"
Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future …
Learn, Network, and Accelerate Optical Design Innovation For this year’s event, we are excited to be discussing the latest in optical design and simulation, including topics on image simulation with the entire image chain, freeform optics, display technnology, high-performance computing for photonic devices, and other applications using the Optical Solutions suite of tools. More details …
Join experts from Rambus and PUF-based security solutions provider ICTK to learn how Rambus Root of Trust and Secure Authentication solutions combined with ICTK’s PUF technology can provide a highly robust hardware foundation to protect data, devices, and cloud. Our session will provide an overview of ICTK and its PUF technology, discuss the features and benefits of Root of Trust …
