Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Are FPGA booting challenges causing frustrating delays and leaving you uncertain about project timelines? Have you spent countless hours wrestling with boot image creation, only to encounter hardware dependencies or secure boot issues that stall progress? Eliminate the guesswork and …
Join your colleagues in beautiful San Diego. Make plans to attend and learn about latest insights, and breakthroughs. New this year - a symposium on Astronomical Applications. We are excited to announce the addition of a fourth symposium sharing advances in space and ground telescopes, UV/x-ray/gamma-ray astronomy, exoplanet detection, and more. Join leading researchers and …
Space and Missile Defense - Defending America at Home and Abroad The SMD Symposium is the leading educational, professional development and networking event in the space and missile defense community. The symposium is widely attended by leaders and professionals from the United States and our allies around the world. REGISTER HERE
FMS: the Future of Memory and Storage has expanded the scope of Flash Memory Summit to encompass all tiers of Memory and Storage. As a leading global independent conference and exhibition, FMS is now in its 19th year, offering enhanced support to the industry. Serving as a centralized hub for professional growth, industry connections, and customer …
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Date: Aug 05, 2025 | 10:00 AM PDT Featured Speakers: Priyank Shukla, Director of Product Management, Synopsys Kent Lusted, Distinguished Architect, Synopsys Why You Should Attend: Understand Industry Readiness: Explore the challenges and opportunities in the race to 448G SerDes and assess if the industry is prepared for this leap in high-speed serial interfaces. Learn About Emerging Standards: Gain insights into the …
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Featured Speakers: Priyank Shukla, Director of Product Management, Synopsys Kent Lusted, Distinguished Architect, Synopsys Why You Should Attend: Understand Industry Readiness: Explore the challenges and opportunities in the race to 448G SerDes and assess if the industry is prepared for this leap in high-speed serial interfaces. Learn About Emerging Standards: Gain insights into the latest advancements in standards shaping …
Continue reading "Webinar: 448G: Ready or Not, Here it Comes!"
During the 39th Annual Small Satellite Conference, we will delve into the innovations, demands, and cross-market collaborations shaping the future of satellite capabilities and driving new opportunities allowing us to collectively reach new horizons. REGISTER HERE
Featured Speakers: Anders Blom, Principal Solutions Engineer, Synopsys Gabriele Penazzi, Senior Staff Engineer, Synopsys Vaida Arcisauskaite, Staff Engineer, Synopsys Join us to explore the transformative impact of atomistic simulations and GPU acceleration on materials engineering. Learn how these technologies are revolutionizing the exploration of new materials by reducing simulation turnaround times, increasing model sizes, and …
Continue reading "WEBINAR: GPU-Accelerated Atomistic Simulations for Semiconductor Manufacturing"
Where Inspiration Meets Innovation Join us on August 13 for CadenceLIVE India 2025 at the Sheraton Grand Bengaluru Whitefield Hotel & Convention Center, where Cadence technology users connect with the engineers and industry leaders who develop the solutions and the industry experts who influence market trends. Experience a day of learning, connection, and cutting-edge technology shaping …
The 34th USENIX Security Symposium will take place on August 13–15, 2025, at the Seattle Convention Center in Seattle, WA, USA. The USENIX Security Symposium brings together researchers, practitioners, system programmers, and others interested in the latest advances in the security and privacy of computer systems and networks. The full symposium program will be available soon; view …
Architecting an SoC is a complicated step in building a successful chip. The first step is ensuring you have the critical requirements for your SoC captured so that the possible architectural options may be explored and the IP components that enable those architectures can be identified. Selecting the right IP can make or break your …
Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer …
