Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
About this event Join our upcoming webinar to discover how VisionSym transforms CAD models into photorealistic images using LightTools or LucidShape—eliminating the need for physical prototypes. With GPU-accelerated ray tracing and photometrically accurate simulations, VisionSym enables both design verification and visual appearance evaluation in one streamlined workflow. In this session, you’ll learn how to: Validate designs against …
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About this event This discovery training introduces ImSym – Imaging System Simulator, an advanced platform for end-to-end imaging system simulation. ImSym allows engineers to virtually prototype imaging systems by modeling the full image formation pipeline, from scene and optics through the detector and image signal processing. This enables earlier insight into real-world image performance and …
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Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
**Please register with professional email address** As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst! This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We'll define the key criteria that …
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Google Cloud offers powerful compute, networking and GPU/TPUs to run your workloads. But how to feed the beast? EDA workloads require a lot of data and scalable storage plays is that data hub which keeps your workloads going. Google worked with NetApp - a premier on-premises choice for EDA shared storage - to build a …
**Please register with professional email address** As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst! This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We'll define the key criteria that …
Continue reading "Webinar: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools"
Featured Speakers: Richard Solomon, Senior Staff Technical Product Manager, Synopsys Ron Lowman, Staff Product Manager, Synopsys Heterogeneous compute platforms are driving new requirements for connectivity across increasingly complex system architectures. This webinar explores how PCIe and CXL can be used to provide efficient and high-performance chip-to-chip connectivity, across host-to-memory, host-to-networking, host-to-host, and host-to-accelerator designs in …
Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI …
International Test Conference is the world's premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back to process and design improvement. At IEEE ITC India, design, test, and yield professionals can confront …
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About this event Join us for our annual LucidShape User Group Meeting— This year’s meeting brings together the LucidShape community for a day of insights, innovation, and collaboration. Whether you're focused on automotive lighting, simulation workflows, or advanced design techniques, you’ll gain practical knowledge you can apply right away. What You’ll Experience Latest LucidShape Innovations …
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