Chiplet Summit 2026

Santa Clara Convention Center Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States

All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE

Wafer-Level Packaging Symposium 2026

Hyatt Regency San Francisco Airport 1333 Bayshore Highway, Burlingame, CA, United States

Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …

FLEX 2026 – Technology Summit

The WIGWAM The Wigwam, 300 E Wigwam Blvd, Litchfield Park, AZ, United States

FLEX 2026 | TECHNOLOGY SUMMIT | FEBRUARY 24-26, 2026 THE WIGWAM ARIZONA RESORT | PHOENIX, AZ A 25th Anniversary Celebration Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ. FLEX—Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge …

DVCON U.S. 2026

Hyatt Regency Hotel, Santa Clara, CA Santa Clara, CA, United States

DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog, Verilog, VHDL, PSS, SystemC and e, as well as general purpose languages such as …

embedded world 2026

Exhibition Centre Nuremberg Exhibition Centre Nuremberg, Messezentrum 1, Nürnberg, Germany

Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, …

Semitracks Course: EOS, ESD and How to Differentiate

Munich, Germany Munich, Germany

Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between the two …

IRPS 2026

Loews Ventana Canyon Resort Loews Ventana Canyon Resort, 7000 N Resort Dr, Tuscon, AZ, United States

About IRPS For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and …