Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical …
Are you driving design change? Do you think you have successfully overcome challenges that may affect the electronic revolution? CadenceLIVE is willing to provide a platform to share your story. Come here to show your expertise, share and provide professional skills to help engineers solve the complexity and challenges they face today. CadenceLIVE China 2025 …
