Connecting the data center ecosystem to design, build & operate sustainable data centers for the AI age Bringing together more than 4,000 senior leaders working on Europe's largest data center projects, DCD>Connect | London will drive industry collaboration, help you forge new partnerships and identify innovative solutions to your core challenges. "First class event that …
SAE International's COMVEC™ serves as the premier event, or perhaps, ecosystem where global leaders from the on-highway, off-highway, and defense sectors come together in a neutral setting to collaborate on solutions for daily challenges, both large and small. Get out of the office and join the worldwide commercial vehicle community in Schaumburg, Illinois, where we’ll …
EMPC 2025 is the 25th European Microelectronics & Packaging Conference, an international event for microelectronics packaging, assembly, and interconnection technologies, taking place in Grenoble, France, from September 16–18, 2025. The conference focuses on advanced packaging, new materials, power electronics, medical electronics, and sustainability, bringing together industry experts, researchers, and innovators to share knowledge and showcase cutting-edge …
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Join us for an in-person seminar to explore the future of custom design and migration with AI-powered Virtuoso Studio. Discover how the latest innovations from Cadence are transforming analog, custom, RFIC, and MMIC design. Learn how these advancements enable faster, smarter insight analysis and more precise workflows using agentic AI. We will discuss: Harnessing Agentic …
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Functional ECO (Engineering Change Order) continues to pose a persistent challenge for ASIC designers. To address this, Easy-Logic Technology, in collaboration with SemiWiki, is launching a webinar series focused on tackling ECO challenges across various ASIC design segments—starting with Mixed-Signal ASICs. Why Mixed-Signal ASICs? Mixed-signal ASICs are found in everyday applications such as power management, …
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