31 JANUARY - 2 FEBRUARY 2023 BARCELONA - GRAN VIA VENUE HALL 4 LEADING DIGITAL TRANSFORMATION Your radar into industry transformation! Explore the potential of new products, services, and business models, and understand how these …
The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart …
*Company email required for registration* Register Transfer Level (RTL) power analysis, performed early in the design cycle, is a key component of end-to-end methodology to maximize energy efficiency. Such analysis …
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Join us to hear about new capabilities and features in our 2023 R1 release of Ansys Lumerical. We introduce specific accuracy, performance, and usability improvements across our products, as we …
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Best Conference Papers from 2022 These papers are selected from DVCon and CadenceLive! in 2022 as being most relevant to the DVClub Europe community. Agenda (GMT) 12:00 Welcome and Introduction …
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Register for CadenceTECHTALK to find out how to achieve verification closure with the same coverage with up to a 10X reduction in simulation cycles. Chips are becoming bigger and more …
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Crack the Verification Double Trouble! Register for CadenceTECHTALK to find out how to achieve verification closure with the same coverage with up to a 10X reduction in simulation cycles. Chips …
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Ansys Speos pushes the innovation envelope to deliver accurate, high-performance simulation capabilities for optics designers. The 2023 R1 Release delivers powerful capabilities that speed time to result, improve simulation accuracy, …
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Day 1 (February 1, 2023) of this workshop series will cover practical knowledge of the best datapath verification strategies and provide hands-on experience with the industry's best-in-class datapath validation app …
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This webinar will discuss the benefits of a multiphysics approach to electric motor design and explore different simulation solutions. We’ll share relevant examples and case studies with electric motor design …
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Thermal signature modelling is one of the most challenging steps on the EOIR mission simulation thread; depending on the materials it's made of and the heat loads a target is …
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The 2023 R1 release of Minerva improves engineering productivity with an efficient simulation process, data management, and an easier way to manage data across tasks performed by development teams. Register …
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