ICCAD 2025

Munich, Germany Munich, Germany

The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …

Webinar: Rapid Design Space Exploration of AI functions on Lattice FPGAs using Catapult High-Level Synthesis

Online

The increasing demand for accelerated computing solutions calls for an agile hardware design methodology to be able to keep up with fast evolving landscape of algorithms. Traditional hardware design methodology has long development cycles involving defining architecture, doing microarchitecture development using RTL, and performing verification. An agile workflow requires being able to iterate through the …

Webinar: Accelerating RTL-to-GDS digital implementation with generative and agentic AI: powered by Aprisa AI & the Siemens EDA AI System

Online

As digital chip design complexity grows, engineering teams face increasing pressure to meet aggressive PPA targets on tight schedules. To overcome this challenge, the EDA industry requires a revolutionary shift towards AI. Siemens EDA is leading this transformation by implementing a comprehensive strategy that combines machine learning, reinforcement learning, generative, and agentic AI across the …

Webinar: Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Online

November 4, 2025 | 10:00 AM PST This webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that goes beyond simple k-factor analysis. The methods will be demonstrated using Qorvo GaN technology and related non-linear models that have been modified to facilitate advanced …

Electronic Packaging Days 2025

Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee 25, Building 17/3, Berlin, Germany

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between …

SEMIEXPO Vietnam 2025

Hanoi, Vietnam Hanoi, Viet Nam

As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for …

SemIsrael Expo 2025

Avenue Convention Center Airport City, Israel

Connecting the Dots: Empowering the Semiconductor Community SemIsrael Expo 2025 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields …

Webinar: 5 Expectations for the Compute Market in 2026

Online

November 12, 2025 - 11:00 AM EST    November 13, 2025 – 10:00 AM JST/KST Discover the 5 Critical Compute Market Trends Reshaping Semiconductors in 2026 Datacenter accelerators, advanced nodes, and geopolitical tensions—what’s next for compute semiconductors. The compute semiconductor market is entering a transformative period. While datacenter accelerators drive rapid growth, traditional PC and mobile …

SC25

America’s Center America’s Center, 701 Convention Plaza, St. Louis, MO, United States

The International Conference for High Performance Computing, Networking, Storage, and Analysis HPC Ignites. St. Louis is the place to be this fall as the high performance computing community convenes for …

MASTER CLASS: Component-based transfer path analysis and virtual prototyping

Leuven, Belgium Leuven, Belgium

The Component-based TPA and Virtual Prototyping Master Class is a 3-day live training event that brings together the NVH community at the NVH facility in Leuven, Belgium. This immersive program features theoretical lectures and insights from industry leaders, supported by live demonstrations, interactive sessions, and more than 9 hours of hands-on workshops in small groups. The master …

SEMICON Europa 2025

Messe Munchen Munich, Germany

SEMICON Europa 2025 is co-located with productronica and will take place in November 18-21, 2025 in Munich, Germany. This year’s theme Global Collaborations for European Economic Resilience expresses that global collaborations are not …

Sensing (R)evolution: Sustaining Europe’s Leadership

ICM – International Congress Center Messe München Messe München GmbH, Messegelände, München, Germany

Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart …

MEMS & Imaging Sensors Summit 2025

ICM – International Congress Center Messe München Messe München GmbH, Messegelände, München, Germany

Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart …

2025 SIA Awards Dinner

Signia by Hilton San Jose 170 S Market St, San Jose, CA, United States

Date: Nov. 20, 2025 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 PRIORITY SPONSORSHIP PERIOD NOW OPEN! The 2025 SIA Awards Dinner Priority Sponsorship Period is now open! Only Gold …

2025 GSA Awards Dinner Celebration

Santa Clara Convention Center Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States

GSA recognizes semiconductor companies that have demonstrated excellence through their success, vision, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to …

CadenceTECHTALK: Quantus Insight: Intelligent Parasitic Debugging, Optimization, and Signoff Closure

Online

Speaker: Kee Tat Ong, Principal Application Engineer 10:00am~11:00am Quantus Insight: Intelligent Parasitic Debugging, Optimization, and Signoff Closure 11:00am~11:15am Q&A Description: With more designs migrating to advanced process nodes, chips are …