SPIE Optifab 2025

Join colleagues at the largest optical manufacturing conference and exhibition in North America SPIE Optifab is the premier event to meet with top companies and learn about the latest optical …

RISC-V Summit North America 2025

Santa Clara Convention Center Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States

RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive, data center, space, IoT, embedded and more. Each day, thousands of engineers around the world collaborate and contribute to advance RISC-V. The RISC-V community shares the …

Webinar: Pushing more power with CoolGaN™: design, layout and thermal management

Online

Webinar date: 22.10.2025 | 9 AM CEST | 5 PM CEST Join our webinar and learn about the fundamentals of Gallium Nitride (GaN) technology and its applications in power systems. You will gain a deep understanding of gate drive circuit design, layout steps, and thermal management guidelines for GaN transistors and applications in high-switching frequency …

Achieving Timing Closure in FPGA Designs Workshop

Online

Achieving Timing Closure in FPGA Designs Workshop Do you find it challenging to close timing in your FPGA design? This workshop will guide you through leveraging AMD Vivado’s tools, optimizing your design, and applying best practices for static timing analysis to achieve reliable timing closure. Gain hands-on experience with timing closure techniques and learn strategies to improve …

Webinar: 5 Expectations for the Power Market in 2026

Online

October 22, 2025 - 11:00 AM EST    October 23, 2025 – 10:00 AM JST/KST Discover the 5 Critical Power Market Trends Reshaping Semiconductors in 2026 Wide-bandgap disruption, PMIC innovation, and datacenter power demand, what’s next for power semiconductors. The rise of AI datacenters is driving unprecedented demand for power, creating both massive opportunities and major …

EU Chips Act 2.0 Webinar

Online

Europe's Role & Chips Act 2.0 Priorities The European Union is currently developing a new version of the Chips Act program. The European Chips Act 2.0 represents a strategic initiative to strengthen the European semiconductor ecosystem. Building on the original Chips Act adopted in 2023, this updated framework aims to address emerging technologies such as …

Webinar: IP Design Considerations for Real-Time Edge AI Systems

Online

*Work Email Required* Edge AI systems increasingly require on-chip integration of large-capacity memory, compute engines, and inference-optimized accelerators—all within strict power, latency, and footprint constraints. This webinar provides a an overview of IP architecture and integration methodologies that support real-time AI workloads at the edge. We’ll cover: • Memory and compute efficiency: Techniques for optimizing …

2025 TSMC Open Innovation Platform Ecosystem Forum – Tokyo

Grand Hyatt Tokyo 6 Chome-10-3 Roppongi, Minato City, Tokyo, Japan

Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn't just an event; it's a dynamic hub where the brightest minds converge to ignite the next wave of innovation. As the AI …

ICCAD 2025

Munich, Germany Munich, Germany

The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …

Webinar: Accelerating RTL-to-GDS digital implementation with generative and agentic AI: powered by Aprisa AI & the Siemens EDA AI System

Online

As digital chip design complexity grows, engineering teams face increasing pressure to meet aggressive PPA targets on tight schedules. To overcome this challenge, the EDA industry requires a revolutionary shift …

Electronic Packaging Days 2025

Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee 25, Building 17/3, Berlin, Germany

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between …