Share your research and join the outstanding program for 2025 Make plans to join the premier worldwide technical meeting for photomasks, patterning, metrology, materials, inspection/repair, mask business, extreme UV lithography, …
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The 28th edition of the European Microwave Week (EuMW 2025) will come to Utrecht to continue the annual series of highly successful microwave events that started back in 1998. EuMW 2025 comprises three co-located conferences: The European Microwave Conference (EuMC) The European Microwave Integrated Circuits Conference (EuMIC) The European Radar Conference (EuRAD) In addition, EuMW …
The Premier Event for the UK Microelectronics Industry Join thousands of your peers at the premier event uniting the entire value chains across the microelectronics, semiconductor, photonics and embedded systems …
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic …
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. When it comes to embedded software development, managing multiple tools, maintaining version control, and navigating …
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Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
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Join us at WISH, GSA WLI’s premier technical conference that promises to be an inspiring celebration of innovation and empowerment. With around 1,000 attendees, including industry luminaries, visionary entrepreneurs, and brilliant university students in STEM, this event will showcase the evolving landscape of technology. Attendees can look forward to inspiring keynotes from trailblazers who are …
it-sa Expo&Congress in Nuremberg is Europe's largest trade fair for IT security... ...and one of the most important dialogue platforms for IT security solutions. The trade fair covers the entire range of products and services in the field of cybersecurity: hardware, software, training and consulting services as well as Security as a Service. Important topics …
SEMICON West 2025 makes its debut in Phoenix, October 7–9—positioning the city as a key hub for innovation and industry growth. This milestone event gathers global leaders across the microelectronics supply chain to explore transformative technologies, develop the future workforce, and drive strategic collaboration. Now more than ever, we are STRONGER TOGETHER. Programs + Events -CEO …
We're back in the vibrant city of Barcelona, bringing together experts from across the industry From 7th-9th October 2025, we’re reuniting the AutoSens community at the Palau de Congressos in Barcelona to shape the future of ADAS and AV. With over 60 expert speakers, engaging panels, technical case studies, and exploration of 12 key themes, …
The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. *Join us in San Jose October 13-16 for the 2025 OCP …
ABOUT PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …
The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. The MICRO community has enjoyed a …
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RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive, data …
Achieving Timing Closure in FPGA Designs Workshop Do you find it challenging to close timing in your FPGA design? This workshop will guide you through leveraging AMD Vivado’s tools, optimizing your design, …
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The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …
CadenceCONNECT: Jasper User Group 2025 is October 29 and 30 in San Jose, CA. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal verification technologies and methodologies. The Jasper User Group Conference is the premier …
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Unlock the potential of the AMD Kria SOM and discover Time-Sensitive Networking (TSN) benefits for …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between …
