Hello everyone! Welcome to the 2025 DvCon China Conference! As the chair of this conference, l am truly honored to be here with all of you. lt's exciting to gather together and discuss the latest trends and cutting-edge technologies in the field of design verification. In recent years, we've seen tremendous growth in China's chip …
Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
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Transform your Perspective Gain insights into how our customers and partners collaborate with Intel Foundry, explore cutting-edge packaging and test solutions, and delve into the world of resilient supply chains. Get ready to be inspired for the future! Engage with Experts Discover how our cutting-edge process technologies and strong ecosystem alliances have converged into a …
Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
Join us for an Q&A technical session with Madhumita Sanyal, technical product director of HPC IP, and Richard Solomon, principal product manager and vice-president of PCI-SIG, discussing the pivotal role of PCIe 7.0 in enabling high-performance computing, AI clusters, and next-gen chip designs. This session will explore the need of transitioning to PCIe 7.0 for …
Continue reading "Webinar: PCIe 7.0? Understanding Why Now is the Time to Transition"
Webinar content Smart vibration sensors are used, among other things, in infrastructure monitoring in smart cities and in condition monitoring on machines and industrial plants. The sensors used are often based on microelectronic sensors (MEMS), which are tested as components in production but sometimes exhibit different vibration properties in the finished sensor system. In this …
