AI data center networks now operate at a scale where device-level validation no longer reflects real performance. Engineers must understand how systems behave under realistic traffic conditions, not just in isolated tests. Join Ram Periakaruppan, vice president and general manager of network applications and security at Keysight, to learn how large-scale traffic emulation reveals congestion, …
About ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. REGISTER HERE
Learn from leading hardware security researchers & professionals and discuss the latest & most innovative research on attacking and defending hardware. Connect with industry peers. Join us for a bigger, bolder, and better hardwear.io. ARE YOU READY FOR HARDWEAR.IO USA 2026? In the past couple of months our goal was to knuckle down and build …
Continue reading "Hardwear.io Security Trainings and Conference USA 2026"
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
*Company Email Required for Registration* Full-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms, logs, and across hundreds of thousands of lines of code. In this webinar, we will demonstrate how the Bronco …
Continue reading "Webinar: Cutting Full-Chip SoC Debug from Days to Minutes with AI"
As semiconductor complexity increases and board designs become denser, manufacturing teams face tighter tolerances, reduced test access, and rising pressure to maintain yield and throughput. Validating RF performance and high-speed digital signal integrity at production scale adds a new layer of complexity that traditional approaches struggle to address. Join Jason Kary, Senior Vice President and …
Continue reading "Webinar: How Manufacturing Complexity Increased, and Why Validation Had to Evolve"
Join us in 2026 We are ready to deliver more 3,000+ attendees. Join our community of users, industry experts and trusted partners. Realize LIVE offers something for everyone! 450+ sessions. Explore breakout sessions, technical tracks, trainings and more. More than 60% of sessions were led by customers, sharing real-world insights. 90% overall satisfaction rate. Realize LIVE …
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Main Themes COMPUTEX is a leading global exhibition focused on AIoT and startups. The expo will continue with the position of “AI Next”, featuring the latest tech trends: AI & Robotics, Next-Gen Tech, and Future Mobility. Recognized for its adaptability to industry changes. It has established itself as a premier platform for showcasing technological innovations. …
Welcome to IMS2026 The IEEE International MTT Symposia (IMS) (www.ims-ieee.org) is the world’s premier RF/microwave technical conference and industry exhibition. Attendees will appreciate that IMS2026 has been refreshed with the technical content reorganized, and new branding, new website, and new mobile app launched. IMS2026 kicks off with the IEEE MTT-S RF Integrated Circuits (RFIC) Symposium, …
The Semiconductor Wafer Test Conference (SWTest) is celebrating its 35th year as the only industry event that focuses on all the aspects associated with microelectronic wafer and die level testing. The conference has the perfect mixture of manufacturer and vendor presentations. It is a probe technology forum where attendees come to learn about recent developments …
Join the UK’s largest expo dedicated to cutting-edge hardware technology for innovation-driven engineers At Hardware Pioneers Max you have the unique opportunity to meet with leading experts and suppliers that can help you learn faster, make better decisions and speed up your product development process. REGISTER HERE
June 10 8:00 AM - June 11 5:00 PM CEST 2026 European Executive Forum Munich, Germany REGISTER HERE
“How Will Agentic AI Change Chip Design and Verification?” features EDA and emerging agentic AI company executives and entrepreneurs discussing changes within chip design and verification as agentic AI tools become more mainstream. Panelists will distill the excitement surrounding the innovation in chip design and verification, collaboration between traditional EDA and agentic AI startups and …
New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing …
We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics. Join us to stay at the forefront of innovation …
**Work Email Required for Registration** Embedded systems programs rarely fail because any one team lacks capability. They fail because critical engineering artifacts drift out of alignment over time and distance. This includes requirements, architecture, implementation, verification, hardware bring-up, firmware, and customer documentation. Local correctness does not guarantee lifecycle coherence. llmda.ai believes that consistency itself should …
Continue reading "Webinar: How Agentic AI Keeps Documentation Consistent and Accurate"
Themed Heterogeneous Integration: Bolstering Europe's Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging …
CONFERENCE & EXHIBITION HPC, AI, Quantum: Powering Innovation and Sustainability ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence, high performance computing and quantum technologies, as well as what lies ahead. Additionally, we are committed to sustainability by promoting energy-efficient …
Verification Futures UK 2026, co-located with Semiconductors Futures 2026 organised by Tessolve and co-organised this year with Alpinum. The conference continues its strong tradition of delivering a unique blend of conference presentations, exhibitions, training, and industry networking sessions focused on the challenges faced in hardware and software verification. The event remains an important forum for …
CEA-Leti’s flagship event Discover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026. Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer-electronics sectors. Leave with confidence in the possible. REGISTER HERE
Tutorial Abstract Since the invention of the 1T1C bit cell more than 50 years ago, DRAMs have become the main memory of choice for processors in computing systems and consumer electronics devices. As new computing paradigms have been created, including AI, 3D graphics, HPC, cloud computing, and smart phones, specialized processors and DRAM memories have …
The International Symposium on Computer Architecture (ISCA) is the premier forum for new ideas and experimental results in computer architecture. The conference specifically seeks particularly forward-looking and novel submissions. In 2026, the 53rd edition of ISCA will be held in Raleigh at the Raleigh Convention Center from June 27 to July 1, 2026. REGISTER HERE
Overview The AVS 26th International Conference on Atomic Layer Deposition (ALD 2026) featuring the 13th International Atomic Layer Etching Workshop (ALE 2026) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe …
Join us in 2026 We are ready to deliver more 1,800+ attendees. Join our community of users, industry experts and trusted partners. Realize LIVE offers something for everyone! 350+ sessions. Explore breakout sessions, technical tracks, trainings and more. More than 60% of sessions were led by customers, sharing real-world insights. 90% overall satisfaction rate. Realize LIVE …
Welcome to SMACD 2026 International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design REGISTER HERE
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
The Long Beach Convention Center will serve as a dynamic venue for DAC 2026: The Chips to Systems Conference. Set along the scenic Southern California coastline, the center offers modern meeting spaces and a vibrant setting that reflects the innovative spirit of DAC. Its central location in downtown Long Beach provides easy access to hotels, …
Where your digital transformation gets real — fast We are excited to be visiting a new city with the Realize LIVE digital transformation conference to showcase artifial intelligence, digitalization, sustainability and optimization across the product lifecycle. Learn, network and connect with the Siemens software community, and walk away with new tools and insights for your …
What is the AI Infra Summit? The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to benefit from domain-specific content, all while doing business on the exhibition floor. Our 4 track event is divided into Hardware & Systems, Edge AI Infrastructure, Enterprise AI, …
