ABOUT PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The …
The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in …
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RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive, data …
Achieving Timing Closure in FPGA Designs Workshop Do you find it challenging to close timing in your FPGA design? This workshop will guide you through leveraging AMD Vivado’s tools, optimizing your design, …
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The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …
CadenceCONNECT: Jasper User Group 2025 is October 29 and 30 in San Jose, CA. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world …
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Unlock the potential of the AMD Kria SOM and discover Time-Sensitive Networking (TSN) benefits for …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between …
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for …
Connecting the Dots: Empowering the Semiconductor Community SemIsrael Expo 2025 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields …
The International Conference for High Performance Computing, Networking, Storage, and Analysis HPC Ignites. St. Louis is the place to be this fall as the high performance computing community convenes for …
The Netherlands has been the home for Hardwear.io since 2015. We are very excited to host the industry from automotive, healthcare, semiconductor, IoT, industrial control systems and Govt/Defences Institutes to …
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SEMICON Europa 2025 is co-located with productronica and will take place in November 18-21, 2025 in Munich, Germany. This year’s theme Global Collaborations for European Economic Resilience expresses that global collaborations are not …
Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart …
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From Theory to Practice: Applying Timing Constraints Workshop Do you struggle to identify which constraints are needed for a design or how to properly input them? This workshop will cover how to use features in Vivado, clock domain crossing strategies, and how to get the most out of static timing analysis for Versal devices. This …
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Date: Nov. 20, 2025 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 PRIORITY SPONSORSHIP PERIOD NOW OPEN! The 2025 SIA Awards Dinner Priority Sponsorship Period is now open! Only Gold …
Description Clock domain crossings (CDCs) are a critical aspect of FPGA and embedded system design, and handling them correctly is essential for reliable operation. In this one-hour webinar, we’ll break down CDC fundamentals, explore best practices for managing single-bit and bus CDCs, and demonstrate how to leverage Xilinx Parameterized Macros (XPM) for seamless synchronization. Join …
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100 YEARS of FETs: SHAPING the FUTURE of DEVICE INNOVATIONS Inside IEEE IEDM 2025 Focus Sessions Focus Session #1 - Efficient AI Solutions: Architecture, Circuit, and 3D Integration Innovations for Memory and Logic Focus Session #2 - Beyond Silicon: The Invisible Revolution in Thin-Film Transistors Focus Session #3 - From P-bits to Qubits: Classical, Quantum-Inspired …
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Essential Debugging Techniques Workshop This workshop is for hardware engineers, system architects, and anyone who wants to learn best practices for debugging challenging issues encountered while developing FPGAs, SoCs, PCBs, and embedded systems using the Vivado Design Suite. The features and capabilities of the Vivado Integrated Logic Analyzer are covered in lectures and demonstrations, along with …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
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Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between the two …
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