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Description Clock domain crossings (CDCs) are a critical aspect of FPGA and embedded system design, and handling them correctly is essential for reliable operation. In this one-hour webinar, we’ll break down CDC fundamentals, explore best practices for managing single-bit and bus CDCs, and demonstrate how to leverage Xilinx Parameterized Macros (XPM) for seamless synchronization. Join …
Speaker: Hong-Cheang Quek, AE Director 10:00am~11:00am iPegasus Verification System for Virtuoso Studio 11:00am~11:15am Q&A Description: Today's complex SoC designs significantly increase layout creation and verification time, especially at advanced nodes. To meet overall demand for faster design cycle turnaround time, bridge a demand gap, and improve productivity between custom implementation and physical verification tools, Cadence …
Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event; it’s a dynamic hub where the brightest minds converge to ignite the next wave of innovation. As the AI …
GSA recognizes semiconductor companies that have demonstrated excellence through their success, vision, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to be selected as a nominee and an even more distinguished achievement to win a GSA Award. REGISTER HERE
100 YEARS of FETs: SHAPING the FUTURE of DEVICE INNOVATIONS Inside IEEE IEDM 2025 Focus Sessions Focus Session #1 - Efficient AI Solutions: Architecture, Circuit, and 3D Integration Innovations for Memory and Logic Focus Session #2 - Beyond Silicon: The Invisible Revolution in Thin-Film Transistors Focus Session #3 - From P-bits to Qubits: Classical, Quantum-Inspired …
Speaker: Kee Tat Ong, Principal Application Engineer 10:00am~11:00am Quantus Insight: Intelligent Parasitic Debugging, Optimization, and Signoff Closure 11:00am~11:15am Q&A Description: With more designs migrating to advanced process nodes, chips are getting smaller, but design complexity is increasing in order to deliver better power, performance, or area. These optimizations are restricted by the time window to …
Essential Debugging Techniques Workshop This workshop is for hardware engineers, system architects, and anyone who wants to learn best practices for debugging challenging issues encountered while developing FPGAs, SoCs, PCBs, and embedded systems using the Vivado Design Suite. The features and capabilities of the Vivado Integrated Logic Analyzer are covered in lectures and demonstrations, along with …
The world’s most powerful tech event is your place to experience the innovations transforming how we live. This is where global brands get business done, meet new partners and where the industry's sharpest minds take the stage to unveil their latest releases and boldest breakthroughs. Get a real feel for the latest solutions to the …
Join us at the Ritz-Carlton in Half Moon Bay, CA to get the latest insights on economic trends, market drivers, geopolitics, technology, and what these will mean for the near future to help drive your business forward. The cooperative platform of ISS and its tremendous collective assets will serve to help power your strategies for …
Share your work, insights, and breakthroughs. The 2026 call for papers is open. SPIE Photonics West is the world’s largest optics and photonics technologies event. Present your research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum, and emerging vision technologies. Conferences and Courses: 17–22 January This is the place to be in January …
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx. Download the Call for Presentations! Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. What’s New Download the ISSCC 2026 …
All the Solutions for Developing Chiplets 2025 Keynote Addresses from Industry Leaders: Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne 2025’s Main Topics Included: AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries signup to be a 2026 SPONSOR / Exhibitor REGISTER HERE
Formatting Advanced Packaging for the Next Generation The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …
