ICCAD 2025

Munich, Germany Munich, Germany

The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …

Webinar: Accelerating RTL-to-GDS digital implementation with generative and agentic AI: powered by Aprisa AI & the Siemens EDA AI System

Online

As digital chip design complexity grows, engineering teams face increasing pressure to meet aggressive PPA targets on tight schedules. To overcome this challenge, the EDA industry requires a revolutionary shift …

Webinar: 5 Expectations for the Sensor Market in 2026

Online

November 5, 2025 - 11:00 AM EST    November 6, 2025 – 10:00 AM JST/KST Discover the 5 Critical Sensor Market Trends Reshaping Semiconductors in 2026 From 8K smartphones to AI at the edge—explore the next generation of image sensor innovation. The image sensor industry is shifting from traditional pixel scaling to functionality-driven differentiation, unlocking new …

Electronic Packaging Days 2025

Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee 25, Building 17/3, Berlin, Germany

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration …

SEMIEXPO Vietnam 2025

Hanoi, Vietnam Hanoi, Viet Nam

As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for …