Hear the latest advances from leading experts. Join colleagues in Strasbourg. Hear research presented at this specialized European event for optical instrumentation with the latest advances in optical systems applications, materials, and processing. We look forward to seeing everyone in April. Registration is open. The programme will be available in January. Conferences: 12–16 April 2026 …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
2026 CMC Conference April 14-16, 2026 “Critical Materials at the Crossroads— Driving the Roadmap for Semiconductor Materials” DoubleTree by Hilton Hotel in Portland, Oregon Featuring Keynote: Ben Sell, Vice President and GM of Logic Technology Development at Intel Corporation *The CMC Conference follows the Private CMC Meetings: CMC Fabs-Only on Apr. 13-14 and CMC Joint Session …
Join us on April 16 for CadenceLIVE Silicon Valley 2026, where Cadence technology users connect with the engineers and industry leaders who develop the solutions and the industry experts who influence market trends. Participants experience a day of learning, connection, and cutting-edge technology shaping the future of electronic design and intelligent systems. This premier event …
Join us for CICC 2026, the world's premier conference devoted to IC development. April 19 – 22, 2026 Seattle, WA, USA April 22 - 23, 2026 - CHISIC Workshop About CICC The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, …
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Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test Call for Papers The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test, and manufacturing of electronic circuits and systems. …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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As AI workloads scale into the thousands of accelerators and hundreds of terabytes of distributed memory, traditional interconnects cannot deliver the deterministic latency, bandwidth efficiency, or memory semantic operations required for modern training clusters. UALink provides a purpose built accelerator fabric leveraging 224G SerDes, fixed 64 byte flits, compressed transaction formats, and high efficiency TL/DLL …
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Ensure fabrication success with proven HDI design techniques and real-world tools. Overview: As AI accelerators and edge compute modules push PCB densities to their physical limits, HDI design has become the defining skill separating production-ready boards from layouts that fail at fabrication. This webinar walks through the complete HDI workflow inside Allegro X using a …
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Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
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Join us for the User2User North America event, which is a dedicated environment for exchanging ideas, information and best practices that enable you to lead in your role and achieve success with your customers. Become a Speaker About User2User User2User is your opportunity to learn, grow and connect with fellow technical experts who design leading-edge …
In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs by bringing early, physics based signal integrity feedback into each routing iteration. Rather than relying on repeated, compute intensive 3D FEM cycles during development, Marvell uses a Method of Moments (MoM) early SI check available within …
Physical AI is increasingly popular in applications requiring real-time decision making and autonomous operation. Different from NPUs for cloud platforms, Physical AI processors can be made application-specific. By jointly tuning their ISA and memory architecture to the network models required by the application, power consumption and silicon area are drastically reduced. Synopsys ASIP Designer is …
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