IC Packaging Technology
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
What is the AI Infra Summit? The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to …
Featured Speakers: Madhumita Sanyal, Sr. Director of Technical Product Management, Synopsys Varun Agrawal, Director of Product Management, Synopsys As SoC complexity climbs, traditional verification can't keep pace — and system-level …
Continue reading "Webinar: Shift Left to Ship Faster: Verifying IP and SoCs at Real Workload Speeds"
As RF systems continue to evolve with wider bandwidths and higher frequencies, engineers are navigating faster plays, tighter margins, and more complex signals than ever before. The challenge is no …
Earth observation systems and aerial drones share optical systems design workflow similarities – from telescope and imager architectures, stray-light control, and multi-spectral performance requirements for a variety of applications. In …
MUST USE COMPANY EMAIL TO REGISTER A purpose-built multi-agent system for chip design shouldn't be a quarter-long project. On the Agentrys Studio Platform, the initial build takes about 30 minutes—plus …
Continue reading "Webinar: Agents Assemble: Build Your Chip Design Multi-Agent System in 30 Minutes"
AI ready data centers are reshaping cooling infrastructure, with the industry moving from traditional air cooling toward hybrid and liquid cooling architectures to support higher rack densities and stricter efficiency …
Continue reading "Webinar: Simulation for Data Center Cooling Infrastructure"