Formatting Advanced Packaging for the Next Generation

The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package technologies beyond conventional limits. The Wafer-Level Packaging Symposium will bring together the foremost experts in the semiconductor industry to examine all aspects of wafer and panel-level packaging, 3D device packaging, advanced manufacturing, and testing technologies. Positioned at the forefront of packaging technology evolution, this conference offers global attendees the chance to engage with the latest technological and business trends in the heart of Silicon Valley.

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