
Semitracks Course: Wafer Fab Processing
February 23, 2026 - February 26, 2026

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is a 4-day course that offers an in-depth look into the semiconductor manufacturing process, and the individual processing technologies required to make them. We place special emphasis on the basics surrounding each technique, and we delve into the current issues related to manufacturing the next generation devices. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.
By focusing on the basics of each processing step and the issues surrounding them, participants will learn why certain techniques are preferred over others. Our instructors work hard to explain how semiconductor processing works without delving heavily into the complex physics and mathematical expressions that normally accompany this discipline.
What Will I Learn By Taking This Class?
Participants will learn basic, but powerful, aspects about the semiconductor industry. This skill-building series is divided into three segments:
- Basic Semiconductor Wafer Processing Steps. Each processing step addresses a specific need in IC creation. Participants will learn the fundamentals of each processing step and why they are used in the industry today.
- The Evolution of Each Processing Step. It is important to understand how wafer fab processing came to the point where it is today. Participants will learn how each technique has evolved for use in previous and current generation ICs.
- Current Issues in Wafer Fab Processing. Participants will learn how many processing steps are increasingly constrained by physics and materials science. They will also learn about the impact of using new materials in the fabrication process, and how those materials may create problems for the manufacturers in the future.
This course is a must for every manager, engineer, and technician working in the semiconductor industry, using semiconductor components, or supplying tools to the industry. Our instructors work hard to explain how semiconductor wafer processing works without delving heavily into the complex physics and mathematical expressions that normally accompany this discipline.
Course Objectives
- This course will provide participants with an in-depth understanding of the semiconductor industry and its technical issues.
- Participants will understand the basic concepts behind the fundamental wafer fab processing steps.
- This course will identify the key issues related to each of the processing techniques, and their impact on the continued scaling of the semiconductor industry.
- This course will offer a wide variety of sample problems that participants will work to help them gain knowledge of the fundamentals of wafer fab processing.
- Participants will be able to identify the basic features and principles associated with each major processing step. These include processes like chemical vapor deposition, ion implantation, lithography, and etching.
- Participants will understand how processing, reliability, power consumption and device performance are interrelated.
- Participants will be able to make decisions about how to construct and evaluate processing steps for CMOS, BiCMOS, and bipolar technologies.
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