IRPS 2026

About IRPS

For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic systems through an improved understanding of both the physics of failure as well as the application environment.

IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

IRPS 2026 focus topics:

• New materials: 2D transition metal dichalcogenides (TMDs), (semi)conducting oxides (IGZO, ITO, IWO, InOx, others), (anti)ferroelectrics, low-k dielectrics, reliability of capacitors, junctions, FETs
• 3D packaging and heterogeneous integration: Reliability of 3D, enhanced 2D, chiplets, Si bridge, interposer, RDL technology, hybrid bonding, micro-bump, Cu-pillar and other interconnects
• Data Center Reliability: Emerging trends in Reliability/Availability/Serviceability, silent data corruption, reliability at scale, AI and HPC workloads, On-chip telemetry, thermals, SER

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