IEEE Hybrid Bonding Symposium

January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA

Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx.

Download the Call for Presentations!

Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.

Review the HBS’25 Program, and watch videos of most of the presentations.
Post-Symposium Report on the 2025 Hybrid Bonding Symposium

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