Electronic Packaging Days 2025

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss these with partners.

During the coffee and lunch breaks, participants will be spoilt for choice – a total of 12 IZM laboratories and the clean room will open their doors for half-hour tours. At the same time, expert sessions will offer the opportunity to talk to IZM experts about the institute’s technological services and learn more about the APECS pilot line.

REGISTER HERE