22nd Annual Device Packaging Conference (DPC 2026)

The 22nd Annual Device Packaging Conference (DPC 2026) will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. The 2026 conference will feature 4 keynote presentations, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more.

REGISTER HERE