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AI infrastructure requirements are booming. Larger AI models carry hefty training loads and inference latency requirements, driving an urgent need to scale AI acceleration clusters in data centers. Advanced GPUs and NPUs offer solutions for the computational load. However, insufficient bandwidth or latency between servers… Read More
There is ample evidence that technologies such as high-performance computing, next-generation servers, and AI accelerators are fueling unprecedented demands in data processing speed with massive data storage, lower latency, and lower power. Heterogeneous system integration, more commonly called 2.5 and 3D IC design, … Read More
As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More
When contemplating the Lego-like hardware and software structure of a leading system-on-chip (SoC) design, a mathematically inclined mind might marvel at the tantalizing array of combinatorial possibilities among its hardware and software components. In contrast, the engineering team tasked with its validation may have… Read More
2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More
The Impact of AI on Software and Hardware Development
Part 4 of this series analyzes how AI algorithmic processing is transforming software structures and significantly modifying processing hardware. It explores the marginalization of the traditional CPU architecture and demonstrates how software is increasingly dominating… Read More
The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More
Part 3 of this 4-part series analyzes methods and tools involved in debugging software at different layers of the software stack.
Software debugging involves identifying and resolving issues ranging from functional misbehaviors to crashes. The essential requirement for validating software programs is the ability to monitor… Read More
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
Part 2 of this 4-part series reviews the role of virtual prototypes as stand-alone tools and their use in hybrid emulation for early software validation, a practice known as the “shift-left” methodology. It assesses the differences among these approaches, focusing on their pros and cons.
Podcasts
Podcast EP219: How Synopsys Addresses Debug and Coverage Closure Challenges with Robert Ruiz
Podcast EP188: The New Demands for Memory Design and the Synopsys Approach with Anand Thiruvengadam
Podcast EP185: DRAM Scaling, From Atoms to Circuits with Synopsys’ Dr. Victor Moroz
Podcast EP178: An Overview of Advanced Power Optimization at Synopsys with William Ruby
Podcast EP169: How Are the Standards for the Terabit Era Defined?
Podcast EP152: An Informal Conversation with Aart de Geus on AI and Multi-Die at SNUG
Podcast EP148: The Synopsys View of High-Performance Communication and the Role of Chiplets
Podcast EP141: The Role of Synopsys High-Speed SerDes for Future Ethernet Applications
Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han
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