The rapid evolution of RISC-V processors has introduced unprecedented verification challenges. Modern high-end RISC-V cores now incorporate complex features such as vector and hypervisor extensions, virtual memory systems, multi-level caches, advanced interrupt architectures, and multi-hart out-of-order execution.… Read More
TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!
Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More
CISCO ASIC Success with Synopsys SLM IPs
Cost, Cycle Time, and Carbon aware TCAD Development of new Technologies
Our good friend Scotten Jones wrote a paper on a product that has been in joint development with Synopsys and is now available. Scott is currently President Semiconductor Manufacturing Economics and Senior Fellow at TechInsights. Scott and I have discussed this product many times and I feel it is ground breaking technology for… Read More
How PCIe Multistream Architecture Enables AI Connectivity at 64 GT/s and 128 GT/s
As AI and HPC systems scale to thousands of CPUs, GPUs, and accelerators, interconnect performance increasingly determines end-to-end efficiency. Training and inference pipelines rely on low-latency coordination, high-bandwidth memory transfers, and rapid communication across heterogeneous devices. With model sizes… Read More
WEBINAR: How PCIe Multistream Architecture is Enabling AI Connectivity
In the race to power ever-larger AI models, raw compute is only half the battle. The real challenge lies in moving massive datasets between processors, accelerators, and memory at speeds that keep up with trillion-parameter workloads. Synopsys tackles this head-on with its webinar, How PCIe Multistream Architecture is Enabling… Read More
Lessons from the DeepChip Wars: What a Decade-old Debate Teaches Us About Tech Evolution
The competitive landscape of hardware-assisted verification (HAV) has evolved dramatically over the past decade. The strategic drivers that once defined the market have shifted in step with the rapidly changing dynamics of semiconductor design.
Design complexity has soared, with modern SoCs now integrating tens of billions… Read More
TCAD Update from Synopsys
We live in an exploding AI world, and this has put pressure on foundries to deliver new products faster than ever before. Any help to accelerate the semiconductor R&D goes a long way to make the life of Fab engineers easier. EDA tools in the TCAD (Technology Computer Aided Design) category are critical for TCAD engineers to accelerating… Read More
Synopsys and NVIDIA Forge AI Powered Future for Chip Design and Multiphysics Simulation
In a landmark announcement at NVIDIA’s GTC Washington, D.C. conference Synopsys unveiled deepened collaborations with NVIDIA to revolutionize semiconductor design and engineering through agentic AI, GPU-accelerated computing, and AI-driven physics simulations. This partnership, building on over three decades… Read More
Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys
Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More

