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Acceleration of Complex RISC-V Processor Verification Using Test Generation Integrated with Hardware Emulation

Acceleration of Complex RISC-V Processor Verification Using Test Generation Integrated with Hardware Emulation
by Daniel Nenni on 01-06-2026 at 8:00 am

Acceleration of Complex RISC V Processor Verification Using Test Generation Integrated with Hardware Emulation Synopsys

The rapid evolution of RISC-V processors has introduced unprecedented verification challenges. Modern high-end RISC-V cores now incorporate complex features such as vector and hypervisor extensions, virtual memory systems, multi-level caches, advanced interrupt architectures, and multi-hart out-of-order execution.… Read More


TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!

TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!
by Daniel Nenni on 12-31-2025 at 6:00 am

Synopsys Socionext 3d IC

Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More


CISCO ASIC Success with Synopsys SLM IPs

CISCO ASIC Success with Synopsys SLM IPs
by Daniel Nenni on 12-29-2025 at 10:00 am

cisco silicon one networking 839x473

Cisco’s relentless push toward higher-performance networking silicon has placed extraordinary demands on its ASIC design methodology. As transistor densities continue to rise across advanced SoCs, traditional design-time guardbands are no longer sufficient to ensure long-term reliability, consistent performance,

Read More

Cost, Cycle Time, and Carbon aware TCAD Development of new Technologies

Cost, Cycle Time, and Carbon aware TCAD Development of new Technologies
by Daniel Nenni on 12-18-2025 at 10:00 am

image001

Our good friend Scotten Jones wrote a paper on a product that has been in joint development with Synopsys and is now available. Scott is currently President Semiconductor Manufacturing Economics and Senior Fellow at TechInsights. Scott and I have discussed this product many times and I feel it is ground breaking technology for… Read More


How PCIe Multistream Architecture Enables AI Connectivity at 64 GT/s and 128 GT/s

How PCIe Multistream Architecture Enables AI Connectivity at 64 GT/s and 128 GT/s
by Kalar Rajendiran on 12-09-2025 at 8:00 am

Link Utilization Graph

As AI and HPC systems scale to thousands of CPUs, GPUs, and accelerators, interconnect performance increasingly determines end-to-end efficiency. Training and inference pipelines rely on low-latency coordination, high-bandwidth memory transfers, and rapid communication across heterogeneous devices. With model sizes… Read More


WEBINAR: How PCIe Multistream Architecture is Enabling AI Connectivity

WEBINAR: How PCIe Multistream Architecture is Enabling AI Connectivity
by Daniel Nenni on 11-11-2025 at 8:00 am

multistream webinar banner square

In the race to power ever-larger AI models, raw compute is only half the battle. The real challenge lies in moving massive datasets between processors, accelerators, and memory at speeds that keep up with trillion-parameter workloads. Synopsys tackles this head-on with its webinar, How PCIe Multistream Architecture is EnablingRead More


Lessons from the DeepChip Wars: What a Decade-old Debate Teaches Us About Tech Evolution

Lessons from the DeepChip Wars: What a Decade-old Debate Teaches Us About Tech Evolution
by Lauro Rizzatti on 11-10-2025 at 10:00 am

Lessons from the DeepChip wars Table

The competitive landscape of hardware-assisted verification (HAV) has evolved dramatically over the past decade. The strategic drivers that once defined the market have shifted in step with the rapidly changing dynamics of semiconductor design.

Design complexity has soared, with modern SoCs now integrating tens of billions… Read More


TCAD Update from Synopsys

TCAD Update from Synopsys
by Daniel Payne on 11-03-2025 at 10:00 am

TCAD importance min

We live in an exploding AI world, and this has put pressure on foundries to deliver new products faster than ever before. Any help to accelerate the semiconductor R&D goes a long way to make the life of Fab engineers easier. EDA tools in the TCAD (Technology Computer Aided Design) category are critical for TCAD engineers to accelerating… Read More


Synopsys and NVIDIA Forge AI Powered Future for Chip Design and Multiphysics Simulation

Synopsys and NVIDIA Forge AI Powered Future for Chip Design and Multiphysics Simulation
by Daniel Nenni on 11-03-2025 at 6:00 am

Synopsys Nvidia Agentic AI 2025

In a landmark announcement at NVIDIA’s GTC Washington, D.C. conference Synopsys unveiled deepened collaborations with NVIDIA to revolutionize semiconductor design and engineering through agentic AI, GPU-accelerated computing, and AI-driven physics simulations. This partnership, building on over three decades… Read More


Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys

Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys
by Daniel Nenni on 10-31-2025 at 10:00 am

Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More