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		WP_Term Object
(
    [term_id] => 50
    [name] => Events
    [slug] => events
    [term_group] => 0
    [term_taxonomy_id] => 50
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1449
    [filter] => raw
    [cat_ID] => 50
    [category_count] => 1449
    [category_description] => 
    [cat_name] => Events
    [category_nicename] => events
    [category_parent] => 0
    [is_post] => 
)
  
            
        				
		
	
		
			
		
	
	
		
		
	
	
	
		The semiconductor industry continues to drive innovation and constantly seeks methods to lower costs and improve performance. The advantages of custom I/O libraries versus free libraries can be seen as cost-savings or, more importantly, new markets, new customers, and new business
opportunities.
At DAC 2023, Certus Semiconductor… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		On the heels of the TSMC Symposium and the Intel Foundry update, Samsung held their Foundry Forum today live in Silicon Valley. As usual it was a well attended event with hundreds of people and dozens of ecosystem partners. The theme was the AI Era which is appropriate. As I have mentioned before, AI will touch most every chip and there… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		 
Highlights:
- Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
- There will be technical presentations every hour in the Ansys Booth Theater (#1539)
- Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
… 
Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		At the 2023 SPIE Advanced Lithography and Patterning conference, ASML presented an update on its EUV lithography systems in the field [1]. The EUV wafer exposure output was presented and is shown below in table form:
From this information, we can attempt to extract and assess the EUV wafer output per quarter. First, since there … Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		The first AI Generated Open-Source Silicon Design Challenge invited participants to use generative AI to design an open-source silicon chip and tape it out in just three weeks. The contestants were required to create Verilog code from natural language prompts, and then implemented their designs using the chipIgnite platform… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.
On a humorous note, the person moderating the attendee questions sounded … Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.
Traditionally all interconnects have taken place on the front side of devices with signal and … Read More 
	 
	
	
	
		
	
		
			
		
	
	
		
		
	
	
	
		Plan ahead now because Friday, June 30, is the deadline to submit nominations for the Phil Kaufman Award and the Phil Kaufman Hall of Fame for anyone you think is deserving of these honors. If you haven’t given it any thought, please consider nominating someone.
Before we look at both and the nomination requirements, here’s a thumbnail… Read More 
	 
	
	
	
	
		
	 
	
	
 
		 
		
		
	
The AI PC: A New Category Poised to Reignite the PC Market