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Embracing cloud computing is highly attractive for users of electronic design automation (EDA) tools and flows because of the productivity gains and time to market advantages that it can offer. For Siemens EDA customers engaged in designing large, cutting-edge chips at advanced nanometer scales, running Calibre® design stage… Read More
The integration of artificial intelligence (AI) into Electronic Design Automation (EDA) is revolutionizing chip design, addressing the critical shortage of skilled engineers and accelerating the development process. As Jeff Dyck, Senior Director of Engineering at Siemens EDA, explains in a recent DACtv presentation, … Read More
In my 40 years, I have worked for dozens of companies and just about everyone of them was acquired. Some of the acquisitions were accretive and some were not. Probably the best and most accretive one would be the Solido acquisition by Siemens EDA in 2017. I worked for Solido for ten years reporting to CEO Amit Gupta. I handled Taiwan … Read More
Dan is joined by Marc Hutner. Marc has been innovating in the areas of design, test, DFT and data analytics for more than 20 years. In June of 2023, he joined the Siemens EDA Tessent group as the product director of Silicon Learning, enabling how silicon data is applied to yield improvement and silicon debug. Previously, he worked … Read More
The week before DAC I had the privilege to take a video call with Pradeep Thiagarajan – Product Manager, Simulation, Custom IC Verification at Siemens EDA to get an update on new simulation products. I’ve been following Solido for years now and knew that they were an early adopter of ML for Monte Carlo simulations with SPICE users.… Read More
Dan is joined by Sathishkumar Balasubramanian. Sathish currently leads the product management and marketing organization for CustomIC Verification (CICV) division at Siemens. Sathish is an experienced product leader with over 20+ years of experience in the EDA industry.
Sathish’s focus is on bringing value to the semiconductor… Read More
Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More
An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More
Dan is joined by Dr. John Ferguson, senior director of marketing for the Calibre product line at Siemens EDA. John has worked extensively in physical design verification. Current activities include efforts to extend physical verification and PDK enablement for 3DIC design and silicon photonics.
Dan explores the Siemens EDA… Read More
Visitors to Siemens’ booth (#2521) at the 61st Design Automation Conference (DAC) will see on display the Veloce™ CS system that unifies hardware emulation, enterprise prototyping and software prototyping into one hardware-assisted verification and validation platform.
The display will feature the three single-blade … Read More
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