IC designers are tasked with meeting specifications like robustness in SRAM bit cells where the probability of a violation are lower than 1 part-per-billion (1 ppb). Another example of robustness is a Flip-Flop register that must have a probability of specification violation lower than 1 part-per-million (1 ppm). Using Monte… Read More
Electronic Design Automation
Generative AI for Silicon Design – Article 2 (Debug My Waveform)
Generative AI has been making waves across various industries, and its potential continues to expand. Among its many applications, one particularly intriguing area is the capacity of GenAI to explain digital design waveforms and act as a co-pilot for hardware engineers in the debugging process. In this article, we will explore
S2C’s FPGA Prototyping Accelerates the Iteration of XiangShan RISC-V Processor
S2C announced that the Beijing Institute of Open Source Chip (BOSC) adopted its Prodigy S7-19P Logic System, a VU19P-based FPGA prototyping solution, in the development of the “XiangShan” RISC-V processor. S7-19P not only accelerates the iterations of processor development but also simplifies other companies to realize … Read More
Developing Effective Mixed Signal Models. Innovation in Verification
Mixed-signal modeling is becoming more important as interaction between digital and analog circuitry become more closely intertwined. This level of modeling depends critically on sufficiently accurate yet fast behavioral models for analog components. Paul Cunningham (Senior VP/GM, Verification at Cadence), Raúl Camposano… Read More
Keynote Speakers Announced for IDEAS 2023 Digital Forum
As we all know, hearing directly from the people who actually use EDA tools, people who are solving real world problems with the latest technologies are the best source of information. Thus EDA User group meetings are always first on my event list every year which brings us to Ansys Ideas.
Ansys User Group Meeting Features Technical
… Read MoreEnsuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
Generative AI for Silicon Design – Article 1 (Code My FSM)
In today’s fast-paced world, innovation in semiconductor design is a constant demand. The need for quicker, more accurate, and innovative solutions has paved the way for exploring the potential of Generative AI (#GenerativeAI) in the realm of semiconductor design development. Can it be done? Hell yeah! In this article… Read More
SRAM design analysis and optimization
Every year EDA vendor MunEDA hosts a user group meeting where engineers present how they used automation tools to improve their IC designs, and one presentation from Peter Huber of Infineon caught my attention, it was all about SRAM design optimization. Peter has authored papers at IEEE conferences and been issued patents related… Read More
Managing IP, Chiplets, and Design Data
Design re-use has enabled IC design teams to create billion-transistor designs where hundreds of IP blocks are pre-built from internal or external sources. Keeping track of where each of these IP blocks came from, what their version status is, managing IP, or even discerning their license status can be a full-time job if tracked… Read More
Podcast EP189: A Look at the Q2 Electronic Design Market Data Report Results with Wally Rhines
Dan is joined by Dr. Walden Rhines. Wally is a lot of things, CEO of Cornami, board member, advisor to many and friend to all. For this discussion he is the Executive Sponsor of the SEMI Electronic Design Market Data report.
Dan explores the Q2 results summarized in the report with Wally. Overall growth was around 5%, a much lower number… Read More


AI Bubble?