“Innovations for Next Generation Scaling”
The 2013 Forum today (Feb 5, 2013) started with a presentation by Dr. Gary Patton, VP, IBM Semiconductor Research & Development Center. Gary very clearly articulated the two irresolvable challenges the industry now faces:
- On chip interconnect
- Lithography
These … Read More
TSMC Unveils the World’s Most Advanced Logic Technology at IEDM