By Dr. Dan Tracy, senior director, Industry Research and Statistics, SEMI
With the recent release of Apple’s 6s and the form factors of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for… Read More
Author: Deborah GeigerSEMI
It’s All about Packaging — In this Material World, Who Is Your Partner?
SEMI Releases Industry’s First “Global 200mm Fab Outlook to 2018” and Announces Webinar
SEMI, the global industry association advancing the interests of the worldwide electronics supply chain, today (October 19) published a new report, “Global 200mm Fab Outlook to 2018.” According to the report, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and… Read More
Next Generation of Systems Design at Siemens