Wiki Tag: Foveros

Intel EMIB (Embedded Multi-die Interconnect Bridge)

Intel EMIB (Embedded Multi-die Interconnect Bridge)
by Daniel Nenni on 07-16-2025 at 9:39 pm

EMIB (Embedded Multi-die Interconnect Bridge) is an advanced 2.5D packaging technology developed by Intel that enables high-density, high-bandwidth, low-latency interconnects between chiplets (dies) within a single package—without requiring a full silicon interposer. EMIB offers a modular and scalable approach to … Read More

3D IC (Three-Dimensional Integrated Circuit) Wiki

3D IC (Three-Dimensional Integrated Circuit) Wiki
by Daniel Nenni on 07-12-2025 at 3:50 pm

A 3D Integrated Circuit (3D IC) is a device in which two or more active electronic layers (dies or wafers) are vertically stacked and interconnected to function as a single integrated system. These layers are interconnected using fine-pitch vertical interconnects, such as Through-Silicon Vias (TSVs) or hybrid bonds, allowing… Read More