Wiki Tag: CoWos
CoWoPCB (Chip-on-Wafer-on-PCB) Wiki
Chip-on-Wafer-on-PCB (CoWoPCB) is a heterogeneous integration flow in which bare dies (“chips”) are first assembled and interconnected at wafer scale (on an interposer or fan-out carrier). The completed wafer-level module is then finished with board-pitch I/O and mounted directly to a printed circuit board (PCB)—eliminating… Read More
CoPos (Chip-on-Panel-on-Substrate) Wiki
Chip-on-Panel-on-Substrate (CoPoS) is an advanced packaging architecture that “panelizes” the classic chip-on-carrier flow. Instead of building redistribution and interposer structures on round wafers, CoPoS forms them on large rectangular panels, then mounts the finished module onto an organic or glass package substrate.… Read More
CoWoS® (Chip-on-Wafer-on-Substrate) Wiki
CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a critical role in enabling … Read More
TSMC 3D Fabric™ Wiki
TSMC 3D Fabric™ is a comprehensive suite of 3D silicon stacking and advanced packaging technologies developed by Taiwan Semiconductor Manufacturing Company (TSMC) to enable high-performance, power-efficient, and space-optimized system integration. It represents TSMC’s response to growing industry demand for heterogeneous… Read More
3D IC (Three-Dimensional Integrated Circuit) Wiki
A 3D Integrated Circuit (3D IC) is a device in which two or more active electronic layers (dies or wafers) are vertically stacked and interconnected to function as a single integrated system. These layers are interconnected using fine-pitch vertical interconnects, such as Through-Silicon Vias (TSVs) or hybrid bonds, allowing… Read More
Basilisk at Hot Chips 2025 Presented Ominous Challenge to IP/EDA Status Quo