Wiki Tag: 3D Fabric
CoWoS® (Chip-on-Wafer-on-Substrate) Wiki
CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a critical role in enabling … Read More
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