DesignCon 2016 — signal integrity must be power-aware!

DesignCon 2016 — signal integrity must be power-aware!
by Tom Dillinger on 01-31-2016 at 6:00 pm

DesignCon is a unique conference — its tagline is “Where the Chip meets the Board”. Held each January in Santa Clara, the conference showcases a wealth of new technologies for advanced packaging, printed circuit board fabrication, connectors, cables, and related analysis equipment (e.g, BERT, VNA, scopes). Of specific… Read More