Smart Verification for Complex UCIe Multi-Die Architectures

Smart Verification for Complex UCIe Multi-Die Architectures
by Admin on 09-08-2025 at 10:00 am

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By Ujjwal Negi – Siemens EDA

Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More