OpenAccess DB – Productivity and Beyond!

OpenAccess DB – Productivity and Beyond!
by Pawan Fangaria on 03-05-2012 at 10:00 pm

As I have been watching the developments in EDA and Semiconductor industry, it is apparent that we remain fragmented unless pushed to adopt a common standard mostly due to business reasons. Foundries are dictating on the rules to be followed by designs, thereby EDA tools incorporating them. Also, design companies needed to work… Read More


Testing, testing… 3D ICs

Testing, testing… 3D ICs
by Beth Martin on 10-06-2011 at 7:01 pm

3D ICs complicate silicon testing, but solutions exist now to many of the key challenges. – by Stephen Pateras

The next phase of semiconductor designs will see the adoption of 3D IC packages, vertical stacks of multiple bare die connected directly though the silicon. Through-silicon vias (TSV) result in shorter and thinner… Read More