Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More
TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!
