TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips

TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips
by Daniel Nenni on 09-11-2026 at 6:00 am

TSMC OIP 2026

It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.

Mike and… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-17-2026 at 8:00 am

TSMC CoWoS verus Intel EMIB

There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:

Jeff Su: I guess very simply put, EMIB-T, in his view, isRead More