ANSYS Enters the League of 10nm Designs with TSMC

ANSYS Enters the League of 10nm Designs with TSMC
by Pawan Fangaria on 04-09-2015 at 7:00 pm

The way we are seeing technology progression these days is unprecedented. It’s just about six months ago, I had written about the intense collaboration between ANSYSand TSMCon the 16nm FinFET based design flow and TSMC certifying ANSYS tools for TSMC 16nm FF+ technology and also conferring ANSYS with “Partner of the Year” award.… Read More


RedHawk Excels – Customers Endorse

RedHawk Excels – Customers Endorse
by Pawan Fangaria on 05-28-2014 at 11:00 am

Since a few years, I have been following up Ansys Apachetools for semiconductor design, verification and sign-off. RedHawk is the most prominent platform of tools from Ansys, specifically for Power, Noise and Reliability Sign-off. It has witnessed many open endorsements from several of Ansyscustomers through open presentations,… Read More


Fast & Accurate Thermal Analysis of 3D-ICs

Fast & Accurate Thermal Analysis of 3D-ICs
by Pawan Fangaria on 04-14-2014 at 11:00 am

As Moore’s law started saturating on a single semiconductor die, the semiconductor community came up with the approach of growing vertically by stacking dies one above other in a 3D-IC arrangement. However, a major concern with a 3D-IC is that the heat generated by each die can get trapped in the stack, and hence it’s extremely important… Read More