TSMC 2026 Taiwan Technology Symposium

TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
TSMC 3DFabric^® advanced silicon stacking and packaging technology advancement on TSMC-SoIC^®, InFO, CoWoS^®, and TSMC-SoW™
TSMC’s

TSMC 2026 North America Technology Symposium

TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
TSMC 3DFabric^® advanced silicon stacking and packaging technology advancement on TSMC-SoIC^®, InFO, CoWoS^®, and TSMC-SoW™

January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA

Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx.

Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for … Read More