Siemens has announced advances in its collaboration with NVIDIA to accelerate computational lithography, addressing a demanding step in manufacturing advanced AI semiconductors. By integrating NVIDIA’s cuLitho library with Siemens Calibre manufacturing software, the companies aim to make sophisticated photomask optimization… Read More
Designing high-performance multi-chiplet semiconductor packages for hyperscale, HPC and AI applications combines cutting-edge innovation with practical optimization. Embedded silicon bridge substrates enable cost-effective solutions by using base substrates such as organic laminates or redistribution-layer (RDL)… Read More
Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More
Engineering teams are dealing with increasing system complexity, stricter integration requirements and the shift toward software-defined products. Generative AI is emerging as a valuable capability, but it is not sufficient on its own.
To manage complexity and convergence across software and hardware, organizations need… Read More
Designing AI inference hardware for edge applications often requires building custom hardware accelerated solutions to meet the demands for ultra-low power consumption and strict real-time response requirements. This webinar introduces Catapult™ AI NN, which provides an automated flow that starts with a Python neural… Read More
It’s no secret that AI can transform engineering workflows.
But are you getting the most out of your AI efforts?
If you are struggling to leverage AI beyond scripting, this webinar is for you.
Join us to learn how you can use AI, with confidence, to accelerate thermal engineering for space missions.
Although design cycles are getting… Read More
By Mauli Shah, Product Engineer, Siemens
Analog and mixed-signal design teams face a persistent challenge that directly impacts tape-out schedules and project predictability: symmetry violations discovered at signoff trigger expensive respins, delay schedules and create unpredictable iteration cycles. Despite symmetry… Read More
The digital transformation conference designed for professionals in engineering, manufacturing, product lifecycle management, design and IT/software administration. Connecting users, industry experts and partners to share insights and explore the latest trends, technologies and best practices.
For many years, the PCB industry has accepted dielectric values without fully understanding how they were measured—or whether they’re the right values for impedance modeling. This webinar explores what that means for today’s high-speed designs.
As … Read More
When: Tuesday, July 28 | 12:00 PM – 1:30 PM | Lunch provided
Where: Long Beach Convention Center
Agentic AI is redefining what’s possible in custom IC design and verification, and Solido is leading
