Webinar: Tessent UltraSight-V – An on-chip debug and trace solution for RISC-V systems

Webinar: Tessent UltraSight-V – An on-chip debug and trace solution for RISC-V systems
by Admin on 03-24-2025 at 7:57 am

An infrastructure to enable debug and trace for your RISC-V systems is essential to identifying root-causing bugs. In this presentation, we will give an overview of Tessent UltraSight-V, an end-to-end RISC-V debug and trace solution consisting of embedded IPs and software that integrate with industry-standard tools.

We will… Read More


Webinar: Faster Debug of Complex Testbenches Using Visualizer

Webinar: Faster Debug of Complex Testbenches Using Visualizer
by Admin on 02-18-2025 at 1:45 pm

Wednesday, March 5 – 8:00 AM Pacific

Debugging testbenches can be a time-intensive challenge, but modern tools provide advanced features to simplify and accelerate the process.

This webinar will explore essential capabilities such as basic line stepping, dynamic variable monitoring, constraint debugging, and UVM

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Masterclass: Microsoft Focus on IP QA with Solido IP Validation Suite

Masterclass: Microsoft Focus on IP QA with Solido IP Validation Suite
by Admin on 02-04-2025 at 5:31 pm

Microsoft Focus on IP QA with Solido IP Validation Suite 

As System-on-Chip (SoC) designs grow increasingly complex, design IPs have become essential building blocks, promoting modularization and reusability. However, ensuring quality across vast IP libraries with diverse formats and views presents a significant challenge.

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Webinar: An end-to-end functional safety solution for automotive ICs based on ISO 26262

Webinar: An end-to-end functional safety solution for automotive ICs based on ISO 26262
by Admin on 01-17-2025 at 1:10 pm

Development of automotive ICs requires substantial and meticulous effort to ensure their compliance with the ISO 26262 standard. The process involves end-to-end evaluation of a chip’s design, development, and traceability of the systematic and safety workflows through lifecycle management. Engineers must create a Failure

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Podcast EP231: Details of the New Solido Simulation Suite with Sathish Balasubramanian

Podcast EP231: Details of the New Solido Simulation Suite with Sathish Balasubramanian
by Daniel Nenni on 06-27-2024 at 8:00 am

Dan is joined by Sathishkumar Balasubramanian. Sathish currently leads the product management and marketing organization for CustomIC Verification (CICV) division at Siemens. Sathish is an experienced product leader with over 20+ years of experience in the EDA industry.

Sathish’s focus is on bringing value to the semiconductor… Read More